Impedane measurement of chip, package, and board power...

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Electrical signal parameter measurement system

Reexamination Certificate

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Reexamination Certificate

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11424613

ABSTRACT:
A method for measuring impedance of a microprocessor chip, electronic packaging, and circuit board power supply system by generating a pseudo-impulse current having a width size in the time domain not larger than the inversion of a maximum frequency of interest and obtaining a voltage measurement in a frequency domain of the pseudo-impulse current. The mechanism of the present invention then predicts the normalized Fourier transformation of the current in the frequency domain, wherein the normalized Fourier transformation depends upon a switching charge of the pseudo-impulse current, measures the switching charge of the pseudo-impulse current, obtains a first current measurement at zero frequency using the measured switching charge, and obtains a second current measurement at a frequency of interest using the first current measurement. The mechanism of the present invention then calculates the impedance of the chip/package/board power supply system using the voltage measurement and the second current measurement.

REFERENCES:
patent: 6768952 (2004-07-01), Kantorovich et al.
patent: 6911827 (2005-06-01), Kantorovich et al.

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