4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Paul Dijkstra

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active

Air cavity package for a semiconductor die and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Carrier for bonding a semiconductor chip onto and a method...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Carrier, method of manufacturing a carrier and an electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Electronic device and method of manufacturing thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Etch method

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant
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Profile ID: LFUS-PAI-P-2247687

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