Carrier for bonding a semiconductor chip onto and a method...

Details Carrier for bonding a semiconductor chip onto and a method... Carrier for bonding a semiconductor chip onto and a method...

2011-08-02

2011-08-02

Ha, Nathan (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23031, C257S779000

Reexamination Certificate

active

07989934

ABSTRACT:
A carrier (100) for bonding a semiconductor chip (114) onto is provided, wherein the carrier (100) comprises a die pad (101) and a plurality of contact pads (102), wherein each of the plurality of contact pads (102) comprises an electrically conductive multilayer stack, wherein the electrically conductive multilayer stack comprises a surface layer (109), a first buffer layer, and a first conductive layer (108). Furthermore, the first buffer layer comprises a material adapted to prevent diffusion of material of the surface layer (109) into the first conductive layer (108), and at least two of the contact pads (102) has an ultrafine pitch relative to each other.

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