Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2009-02-23
2010-12-28
Parker, Kenneth A. (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S124000, C438S106000, C438S127000, C257S678000, C257S787000, C257S786000, C257S738000, C257S737000, C257S684000
Reexamination Certificate
active
07858444
ABSTRACT:
The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.
REFERENCES:
patent: WO03/085731 (2003-04-01), None
Dijkstra Paul
Groenhuis Roelf Anco Jacob
Schriks Cornelis Gerardus
Van De Water Peter Wilhelmus Maria
Weekamp Johannus Wilhelmus
Nguyen Joseph
NXP B.V.
Parker Kenneth A.
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