4. Metal fusion bonding
  5. Solder form

Paul A. Socha

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Integrated preforms

Metal fusion bonding – Solder form
Patent

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Integrated solder preform array having a tin outer coating

Metal fusion bonding – Solder form
Patent

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Method of forming a gasket of indium and braid

Metal fusion bonding – Process – Diffusion type
Patent

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Solder preform wrappable around a printed circuit card edge

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Wire braid reinforced indium

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture
Patent

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Profile ID: LFUS-PAI-P-710999

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