Integrated preforms

Details Integrated preforms Integrated preforms

1992-06-26

1993-09-07

Heinrich, Samuel M.

Metal fusion bonding

Solder form

228246, 228255, B23K 3514

Patent

active

052420973

ABSTRACT:
A solder preform containing a series of islands that are joined together in a matrix by bridging bands. Each band has a reduced cross-sectional area in its midregion. In one form of this invention, at least some of the islands contain pin receiving holes formed therein and solder tabs that are arranged to frictionally engage a pin that is passed into the hole to prevent the preform from being misaligned or dislodged from the pins and which at the time of bonding, prewets the pins to promote flowing of solder to the pins from the islands to form a superior solder joint.

REFERENCES:
patent: 3750265 (1973-08-01), Cushman
patent: 3932934 (1976-01-01), Lynch et al.
patent: 4050621 (1977-09-01), Bouley
patent: 4216350 (1980-08-01), Reid
patent: 4557411 (1985-10-01), Farquharson et al.
patent: 5029748 (1991-07-01), Lauterbach et al.

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