Integrated solder preform array having a tin outer coating

Details Integrated solder preform array having a tin outer coating Integrated solder preform array having a tin outer coating

1996-06-10

1999-09-28

Ryan, Patrick

Metal fusion bonding

Solder form

228214, B23K 3514, B23K 3522

Patent

active

059573643

ABSTRACT:
An integrated solder preform array is composed of a metal or metal alloy suitable for use in a soldering or bonding process. The preform includes a series of discrete solder islands disposed in a desired matrix. Each island contains a hole for receiving a pin, and bridging strands for joining each of said islands in a matrix. The bridging strands are formed of the same solder material as the islands, with the solder preform containing a substantially uniform coating of tin over its entire outer surface for the purpose of improving solder wetting and therefore elimination of unwanted shorting of circuits and other electrical components being soldered.

REFERENCES:
patent: Re30348 (1980-07-01), Hascoe
patent: 3169048 (1965-02-01), McGinn
patent: 4901908 (1990-02-01), Negura et al.
patent: 5086966 (1992-02-01), Melton et al.
patent: 5242097 (1993-09-01), Socha

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