Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1996-02-27
1997-02-04
Thomas, Laura
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
439 62, 439 59, 439 84, 29843, 29844, H05K 102
Patent
active
056001029
ABSTRACT:
An integral solder preform is disclosed for application to a printed circuit card having first and second sides, a first edge and first and second pluralities of conductive pads disposed on the respective first and second sides of the printed circuit card in respective first and second predetermined conductive pad arrangements. The integral solder preform has first and second pluralites of solder pads having respective first and second solder pad arrangements which are maintained in position by a plurality of bridging solder bands. The first and second solder pad arrangements correspond to the first and second predetermined conductive pad arrangements and are spaced apart by a predetermined distance by spacing solder bands. The printed circuit card is aligned over the spacing solder bands and the first and second solder pad arrangements are wrapped around the first edge such that the first and second solder pad pluralities of solder pads overlay respective first and second pluralities of conductive pads on the printed circuit card. A fixture which may be employed to facilitate the alignment of the solder preform for use with the solder preform is also disclosed.
REFERENCES:
patent: 3750265 (1973-08-01), Cushman
patent: 3931719 (1976-01-01), Schwab
patent: 3932934 (1976-01-01), Lynch et al.
patent: 4050621 (1977-09-01), Bouley
patent: 4216350 (1980-08-01), Reid
patent: 4328921 (1982-05-01), Liang
patent: 4336639 (1982-06-01), Berglund
patent: 4341921 (1982-07-01), Simpson
patent: 4372037 (1983-02-01), Scapple et al.
patent: 4557411 (1985-12-01), Farquharson et al.
patent: 4737115 (1988-04-01), Seidler
patent: 4738625 (1988-04-01), Burton et al.
patent: 5029749 (1991-07-01), Lauterbach et al.
patent: 5167511 (1992-12-01), Krajewski et al.
patent: 5205738 (1993-04-01), Anderson, Jr. et al.
patent: 5242097 (1993-09-01), Socha
patent: 5419708 (1995-05-01), Koss et al.
patent: 5441429 (1995-08-01), Seidler
patent: 5496182 (1996-03-01), Yasumura
Indium Corporation of America
Thomas Laura
LandOfFree
Solder preform wrappable around a printed circuit card edge does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder preform wrappable around a printed circuit card edge, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder preform wrappable around a printed circuit card edge will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-681204