Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-07-12
2011-07-12
Hoffberg, Robert J (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679530, C361S679540, C361S702000, C361S703000, C361S704000, C361S719000, C228S183000, C165S104330, C165S185000, C257S714000
Reexamination Certificate
active
07978473
ABSTRACT:
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.
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Campbell Levi A.
Chu Richard C.
Ellsworth, Jr. Michael J.
Furman Bruce K.
Iyengar Madhusudan K.
Heslin Rothenberg Farley & & Mesiti P.C.
Hoffberg Robert J
International Business Machines - Corporation
Jung, Esq. Dennis
Radigan, Esq. Kevin P.
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