Connection construction and method of manufacturing the same

Details Connection construction and method of manufacturing the same Connection construction and method of manufacturing the same

1995-06-23

1996-11-26

Picardat, Kevin

Fishing, trapping, and vermin destroying

437183, 437192, 437211, H01L 2160

Patent

active

055785271

ABSTRACT:
This invention provides a connection structure and methods of forming the connection structure which combines the advantages of composite bumps and conductive films formed of conductive particles in a non-conductive binder. The conductive film provides conductive particles in a non-conductive binder which can be placed on the input/output pads of an integrated circuit element or substrate. The conductive particles contact composite bumps comprised of a polymer body, having a relatively low Young's Modulus, and a conductive metal coating to form the connection structure. The relatively low Young's Modulus of the composite bumps greatly reduce the recoil forces during bonding. Because of the low recoil forces the connection can be formed with reduced bonding force and forces tending to separate the connection once formed are reduced. The non-conductive binder is cured to form the adhesive between the integrated circuit element and the substrate.

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"Next Generation Liquid Crystal Display and High Density Package Technology", in Finetech Japan '94 Conf. Proceeding, Jul. 13, 1994.
"Interconnection Method of LCD LSIs by TAB-on-Glass and Board To Glass Using Aniostropic Conductive Film and Monosotropic Heat Seal Connections" presented at the 41st Electronic Components and Technology Conference.
IBM Technical Disclosure Bulletin vol. 18, No. 9, Feb. 1976, p. 2817.

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