4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Pak Hong Yee

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Integrated circuit (IC) test assembly including phase change...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Integrated circuit (IC) test assembly including phase change...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Integrated circuit package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Intrinsic thermal enhancement for FBGA package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Intrinsic thermal enhancement for FBGA package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-772118

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