Integrated circuit (IC) test assembly including phase change...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

active

11197823

ABSTRACT:
A testing apparatus and method for testing integrated circuits is disclosed wherein a device under test is continuously maintained at a desired set point temperature by an included thermal body. The thermal body has an enclosed phase change material which provides latent heat to the device under test such that there is negligible temperature variation realized by integrated circuits being tested.

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Chip-Level Embedded Temperature Stabilization Ensures High Accuracy, Low Cost-of-Test, Credence Systems Corporation, Fremont, CA, pp. 1-8.
Wartenberg, Scott, “Contactor Design for Hign-Volume RF Testing”, Microwave Product Digest, Feb. 2003, pp. 1-8.
Pfahnl, Andreas C. et al., “Thermal Management and Control in Testing Packaged Integrated Circuit (IC) Devices”, SAE International, 34th Intersociety Energy Conversion Engineering Conference, Aug. 2-5, 1999, pp. 1-9.

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