4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Orient Semiconductor Electronics Ltd.

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Frame for manufacturing encapsulated semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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Heat dissipation module

Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate

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Lead frame structure and applications thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Mold injection method for semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Package Structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-580884

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