Lead frame structure and applications thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Reexamination Certificate

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Details

C257S674000, C257S696000, C257SE23037, C257SE23042, C257SE23046, C257SE23050

Reexamination Certificate

active

07576418

ABSTRACT:
A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail.

REFERENCES:
patent: 5430250 (1995-07-01), Kwon
patent: 6809408 (2004-10-01), Yu et al.

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