Compositions: coating or plastic – Materials or ingredients – Pigment – filler – or aggregate compositions – e.g. – stone,...
Patent
1997-08-28
1999-08-10
Gulakowski, Randy
Compositions: coating or plastic
Materials or ingredients
Pigment, filler, or aggregate compositions, e.g., stone,...
106401, 106404, 106481, 106482, C04B 1400
Patent
active
059353147
ABSTRACT:
By removing a fraction of fine particles having a particle size of less than 2 .mu.m from starting inorganic filler particles having a mean particle size of 10-50 .mu.m and adding thereto particles having a mean particle size of 0.1-2 .mu.m and a specific surface area of 3-10 m.sup.2 /g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 .mu.m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a low melt viscosity enough to mold and is effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. The encapsulated semiconductor device is highly reliable.
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Asano Eiichi
Fukumoto Takaaki
Higuchi Noriaki
Shiobara Toshio
Tomiyoshi Kazutoshi
Gulakowski Randy
Mitsubishi Denki & Kabushiki Kaisha
Shin-Etsu Chemical Ltd., Co.
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