4. Electrical transmission or interconnection systems
  5. Nonlinear reactor systems
  6. Parametrons

Nippon Steel Semiconductor Corp.

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Bond pad option for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent

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Burn-in board

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Current sensing differential amplifier with high rejection of po

Static information storage and retrieval – Read/write circuit – Differential sensing
Patent

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DRAM having self-timed burst refresh mode

Static information storage and retrieval – Read/write circuit – Data refresh
Patent

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DRAM variable row select

Static information storage and retrieval – Addressing – Including particular address buffer or latch circuit...
Patent

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Profile ID: LFUS-PAI-P-150970

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