4. Measuring and testing
  5. Specimen stress or strain, or testing by stress or strain...
  6. By loading of specimen

Naotaka Tanaka

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Electronic component, electronic component assembly and electron

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Encapsulated semiconductor device package having holes for elect

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Lead frame and semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Lead frame and semiconductor device encapsulated by resin

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Manufacturing process and structure of through silicon via

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Profile ID: LFUS-PAI-P-380418

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