Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2010-09-14
2011-12-06
Sample, David (Department: 1783)
Metal fusion bonding
Process
Plural joints
C228S178000, C228S006200
Reexamination Certificate
active
08070048
ABSTRACT:
In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.
REFERENCES:
patent: 2007/0235500 (2007-10-01), Suh et al.
patent: 08-293668 (1996-11-01), None
patent: 2006-295019 (2006-10-01), None
patent: 2007-095976 (2007-04-01), None
Choi Jae-Hoon
Han Seong-Chan
Kim Jae-Young
Oh Nam-yong
Mehta Megha
Sample David
Samsung Electronics Co,. Ltd.
Stanzione & Kim LLP
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