Reinforced solder bump structure and method for forming a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S738000, C438S613000

Reexamination Certificate

active

07015590

ABSTRACT:
A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusion from the contact pad and the ball pad are sized and arranged to have overlapping under portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and/or crack propagation thereby improving reliability.

REFERENCES:
patent: 5431328 (1995-07-01), Chang et al.
patent: 5674326 (1997-10-01), Wrezel et al.
patent: 5837119 (1998-11-01), Kang et al.
patent: 5906312 (1999-05-01), Zakel et al.
patent: 5914536 (1999-06-01), Shizuki et al.
patent: 5958590 (1999-09-01), Kang et al.
patent: 6028357 (2000-02-01), Moriyama
patent: 6088236 (2000-07-01), Tomura et al.
patent: 6297562 (2001-10-01), Tilly
patent: 6465879 (2002-10-01), Taguchi
patent: 6841872 (2005-01-01), Ha et al.
patent: 2001/0045668 (2001-11-01), Liou et al.
patent: 2001/0054771 (2001-12-01), Wark et al.
patent: 2002/0053467 (2002-05-01), Gebauer et al.
patent: 2003/0167632 (2003-09-01), Thomas et al.
patent: 08-090285 (1996-04-01), None
patent: 11-297873 (1999-10-01), None
patent: 11-345826 (1999-12-01), None
patent: 2000-091371 (2000-03-01), None
patent: 2000-241499 (2000-09-01), None
patent: 2001-284387 (2001-10-01), None
patent: 2002-228707 (2002-08-01), None
patent: 1998-0060735 (1999-08-01), None
patent: 2000-0058035 (2000-09-01), None
patent: 2001-0068233 (2001-07-01), None
patent: 2001-0068378 (2001-07-01), None
patent: 2001-0098699 (2001-11-01), None
patent: 2001-0105270 (2001-11-01), None
Korean Office Action Jul. 11, 2005 for Korean Application No. 2003-0065946.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reinforced solder bump structure and method for forming a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reinforced solder bump structure and method for forming a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reinforced solder bump structure and method for forming a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3535564

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.