Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-03-21
2006-03-21
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S738000, C438S613000
Reexamination Certificate
active
07015590
ABSTRACT:
A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusion from the contact pad and the ball pad are sized and arranged to have overlapping under portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and/or crack propagation thereby improving reliability.
REFERENCES:
patent: 5431328 (1995-07-01), Chang et al.
patent: 5674326 (1997-10-01), Wrezel et al.
patent: 5837119 (1998-11-01), Kang et al.
patent: 5906312 (1999-05-01), Zakel et al.
patent: 5914536 (1999-06-01), Shizuki et al.
patent: 5958590 (1999-09-01), Kang et al.
patent: 6028357 (2000-02-01), Moriyama
patent: 6088236 (2000-07-01), Tomura et al.
patent: 6297562 (2001-10-01), Tilly
patent: 6465879 (2002-10-01), Taguchi
patent: 6841872 (2005-01-01), Ha et al.
patent: 2001/0045668 (2001-11-01), Liou et al.
patent: 2001/0054771 (2001-12-01), Wark et al.
patent: 2002/0053467 (2002-05-01), Gebauer et al.
patent: 2003/0167632 (2003-09-01), Thomas et al.
patent: 08-090285 (1996-04-01), None
patent: 11-297873 (1999-10-01), None
patent: 11-345826 (1999-12-01), None
patent: 2000-091371 (2000-03-01), None
patent: 2000-241499 (2000-09-01), None
patent: 2001-284387 (2001-10-01), None
patent: 2002-228707 (2002-08-01), None
patent: 1998-0060735 (1999-08-01), None
patent: 2000-0058035 (2000-09-01), None
patent: 2001-0068233 (2001-07-01), None
patent: 2001-0068378 (2001-07-01), None
patent: 2001-0098699 (2001-11-01), None
patent: 2001-0105270 (2001-11-01), None
Korean Office Action Jul. 11, 2005 for Korean Application No. 2003-0065946.
Jeong Se-young
Kim Nam-seog
Kim Soon-bum
Lee In-young
Lyu Ju-hyun
Harness & Dickey & Pierce P.L.C.
Lee Calvin
Nelms David
LandOfFree
Reinforced solder bump structure and method for forming a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reinforced solder bump structure and method for forming a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reinforced solder bump structure and method for forming a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3535564