4. Metal fusion bonding
  5. Process
  6. With measuring, testing, indicating, inspecting, or...

N. James Tomassetti

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Assembly of multi-chip modules using eutectic solders

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate

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Clustered processors in an emulation engine

Data processing: structural design – modeling – simulation – and em – Emulation
Reexamination Certificate

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Clustered processors in an emulation engine

Data processing: structural design – modeling – simulation – and em – Emulation
Reexamination Certificate

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Vertically stacked memory chips in FBGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2552310

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