4. Metal treatment
  5. Compositions
  6. Fluxing

Mukund K. Saraiya

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Ceramic chip carrier with lead frame or edge clip

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Optical module with fluxless laser reflow soldered joints

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
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Optical module with tolerant wave soldered joints

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Patent

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Optical module with tolerant wave soldered joints

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
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Solder paste for use in a reducing atmosphere

Metal treatment – Compositions – Fluxing
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Profile ID: LFUS-PAI-P-80637

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