Metal treatment – Compositions – Fluxing
Patent
1989-05-02
1990-04-24
Rosenberg, Peter D.
Metal treatment
Compositions
Fluxing
148 23, B23K 3534
Patent
active
049197290
ABSTRACT:
A solder paste for use in a reducing atmosphere is disclosed. The solder paste includes a solder powder and an alcohol binder. The reducing atmosphere serves as a flux, thereby eliminating flux residues and the problems associated therewith. Solder splattering is reduced by using a polyhydric alcoholic binder which vaporizes or decomposes before the solder liquifies during heating. The use of such a solder paste in a reducing atmosphere results in no hazardous chemical by-products and, because the solder is handled in the form of a paste, is compatible with electrical components requiring precise dimensional tolerances.
REFERENCES:
patent: 2169659 (1939-08-01), Noble
patent: 2547771 (1951-04-01), Pessel
patent: 3309239 (1967-03-01), Harris
patent: 3396454 (1968-08-01), Murdock
patent: 3414964 (1968-12-01), Emeis
patent: 3436278 (1969-04-01), Poliak
patent: 3478414 (1969-11-01), Potter
patent: 3503721 (1970-03-01), Lupfer
patent: 3665590 (1972-05-01), Percival
patent: 4487638 (1984-12-01), Hoge
patent: 4496098 (1985-01-01), Kawakatsu
patent: 4538757 (1985-09-01), Bertiger
patent: 4632295 (1986-12-01), Brusic
Elmgren Peter J.
Emerick Alan J.
Rivenburg, Sr. Dennis L.
Saraiya Mukund K.
Sissenstein, Jr. David W.
Harper Blaney
International Business Machines - Corporation
Klitzman Maurice H.
LaBaw Jeffrey S.
Rosenberg Peter D.
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