Ceramic chip carrier with lead frame or edge clip

Details Ceramic chip carrier with lead frame or edge clip Ceramic chip carrier with lead frame or edge clip

1992-02-18

1993-09-07

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 257690, H01L 2302

Patent

active

052431339

ABSTRACT:
A ceramic chip carrier is disclosed which includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and a lead frame or edge clip which is mechanically and electrically connected to contact pads on the circuitized surface. Each mechanical/electrical connection between the lead frame or edge clip and the contact pads includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.

REFERENCES:
patent: 5025114 (1991-06-01), Braden
patent: 5120678 (1992-06-01), Moore et al.
patent: 5149590 (1992-09-01), Arthur et al.
S. R. Engle et, "Surface Solder Package", IBM TDB, vol. 30, No. 3, Aug., 1987, pp. 1240-1241.

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