Optical module with fluxless laser reflow soldered joints

Details Optical module with fluxless laser reflow soldered joints Optical module with fluxless laser reflow soldered joints

1992-11-16

1997-02-18

Bovernick, Rodney B.

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

385 89, 385 92, 21912163, G02B 642

Patent

active

056048319

ABSTRACT:
An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. One end of the cable includes lands proximate to through holes for soldered connection to pins which extend from the optical sub-assemblies. At the other end of the cable leads extend across interconnection pads on the surface of the rigid interconnect structure for soldered connection. The top surface of the interconnect pads is 10/90 (Sn/Pb) solder to provide a high temperature soldered joint. Solder flux can not be used because cleaning solvents would contaminate the interconnect structure. An atmosphere of formic acid mixed with nitrogen surrounds the lead and pad and a fluxless solder joint is formed.

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