4. Cleaning and liquid contact with solids
  5. Processes
  6. Including use of vacuum, suction, or inert atmosphere

Muhammad M. Rasheed

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Multi-port pumping system for substrate processing chambers

Cleaning and liquid contact with solids – Processes – Including use of vacuum – suction – or inert atmosphere
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Thermal management of inductively coupled plasma reactors

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With radio frequency antenna or inductive coil gas...
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Use of enhanced turbomolecular pump for gapfill deposition...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2182797

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