Cleaning and liquid contact with solids – Processes – Including use of vacuum – suction – or inert atmosphere
Reexamination Certificate
2011-06-21
2011-06-21
Carrillo, Sharidan (Department: 1711)
Cleaning and liquid contact with solids
Processes
Including use of vacuum, suction, or inert atmosphere
C134S001000, C134S001100, C134S018000, C134S022100, C134S022110, C134S026000, C134S030000, C134S031000, C134S037000, C134S042000, C134S096100, C134S098100, C134S186000, C134S902000
Reexamination Certificate
active
07964040
ABSTRACT:
An exhaust foreline for purging fluids from a semiconductor fabrication chamber is described. The foreline may include a first, second and third ports independently coupled to the chamber. A semiconductor fabrication system is also described that includes a substrate chamber that has a first, second and third interface port. The system may also include a multi-port foreline that has a first, second and third port, where the first foreline port is coupled to the first interface port, the second foreline port is coupled to the second interface port, and the third foreline port is coupled to the third interface port. The system may further include an exhaust vacuum coupled to the multi-port foreline.
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Lubomirsky Dmitry
Rasheed Muhammad M.
Santosa James
Applied Materials Inc.
Carrillo Sharidan
Kilpatrick Townsend & Stockton LLP
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