4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Mitsuyasu Matsuo

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Cooling device, semiconductor laser light source device,...

Coherent light generators – Particular temperature control – Liquid coolant
Reexamination Certificate

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Resin seal semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Resin seal semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Resin seal semiconductor package and manufacturing method of the

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Resin seal semiconductor package and manufacturing method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Profile ID: LFUS-PAI-P-311660

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