4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Mitsuo Osada

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Ceramic circuit board and a method of manufacturing the ceramic

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Electric contact materials

Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions
Patent

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Heat sink substrate consisting essentially of copper and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Heat sink substrate consisting essentially of copper and...

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Post sintering operation
Reexamination Certificate

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Housing for semiconductor device

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Special medium during sintering
Patent

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Profile ID: LFUS-PAI-P-421338

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