4. Semiconductor device manufacturing: process
  5. Coating of substrate containing semiconductor region or of...
  6. Insulative material deposited upon semiconductive substrate

Mira Ben-Tzur

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Aluminum-filled via structure with barrier layer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Borderless contact architecture

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Dual-damascene process and associated floating metal structures

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Integrated circuit with improved RC delay

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Integrated circuit with improved RC delay

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2635310

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