Dual-damascene process and associated floating metal structures

Details Dual-damascene process and associated floating metal structures Dual-damascene process and associated floating metal structures

2006-04-11

2006-04-11

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

07026235

ABSTRACT:
In one embodiment, an interconnect line on one level of an integrated circuit is electrically coupled to another interconnect line on another level. The two layers of interconnects may be coupled together using a via. To reduce capacitance between the interconnect lines, an air core is formed between them. The air core may be formed by using a chemistry that includes a noble gas fluoride to etch a sacrificial layer between the interconnect layers.

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