4. Apparel and haberdashery
  5. Footwear
  6. Element or attachment

Mike Brooks

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Bonding support for leads-over-chip process

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Bonding support for leads-over-chip process

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Carrier having slide connectors for testing unpackaged semicondu

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Carrier having slide connectors for testing unpackaged semicondu

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Footwear sole with integral display element

Boots – shoes – and leggings – Soles – Laminated
Reexamination Certificate

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Profile ID: LFUS-PAI-P-315654

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