4. Metal fusion bonding
  5. Process
  6. Repairing, restoring, or renewing product for reuse

Miguel A. Jimarez

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Compliant layer for encapsulated columns

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Encapsulated chip module and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Fixture for attaching a conformal chip carrier to a flip chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Flip chip C4 extension structure and process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Flip chip C4 extension structure and process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1887740

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