Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
Inventor
active
Back-face and edge interconnects for lidded package
Bi-directional buffer line amplifier
Components, methods and assemblies for multi-chip packages
Connection components with anisotropic conductive material...
Enhanced high voltage line interface circuit
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Profile ID: LFUS-PAI-P-1673342