4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Thinning of semiconductor substrate

Michael Melzl

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Electronic component and utilization of a guard structure...

Electricity: electrical systems and devices – Safety and protection of systems and devices – Load shunting by fault responsive means
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Method for machining a workpiece on a workpiece support

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Method of processing a contact pad, method of manufacturing...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Semiconductor device including a power device with first...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Profile ID: LFUS-PAI-P-2206699

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