4. Metal fusion bonding
  5. Process
  6. Plural joints

Michael J. Seddon

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Electronic component and method of manufacture

Metal fusion bonding – Process – Plural joints
Patent

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Encapsulated electronic device structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Encapsulated electronic device structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Flexible substrate for packaging a semiconductor component

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Method of thinning a semiconductor wafer using a film frame

Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1150952

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