Encapsulated electronic device structure

Details Encapsulated electronic device structure Encapsulated electronic device structure

2008-01-15

2008-01-15

Tran, Thien F (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S782000, C257S783000, C257S784000

Reexamination Certificate

active

07319266

ABSTRACT:
In one embodiment, an electronic device package (1) includes a leadframe (2) with a flag (3). An electronic chip (8) is attached to the flag (3) with a die attach layer (9). A trench (16) having curved sidewalls is formed in the flag (3) in proximity to the electronic chip (8) and surrounds the periphery of the chip (8). An encapsulating layer (19) covers the chip (8), portions of the flag (3), and at least a portion of the curved trench (16). The curved trench (16) reduces the spread of die attach material across the flag (3) during chip attachment, which reduces chip and package cracking problems, and improves the adhesion of encapsulating layer (19). The shape of the curved trench (16) prevents flow of die attach material into the curved trench (16), which allows the encapsulating layer (19) to adhere to the surface of the curved trench (16).

REFERENCES:
patent: 6501162 (2002-12-01), Sakamoto et al.
patent: 6624511 (2003-09-01), Sakamoto et al.
patent: 6713849 (2004-03-01), Hasebe et al.

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