4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Michael G. Finley

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Conductive epoxy flip-chip package and method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Conductive epoxy flip-chip package and method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Silicon segment programming apparatus and three terminal...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Silicon segment programming method

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to conductive state
Patent

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Silicon segment programming method and apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Contacts or leads including fusible link means or noise...
Patent

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Profile ID: LFUS-PAI-P-315073

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