Conductive epoxy flip-chip package and method

Details Conductive epoxy flip-chip package and method Conductive epoxy flip-chip package and method

1997-04-03

2000-10-17

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361777, 361783, 257760, 257778, 257783, 174259, 174260, 438108, 29855, H01L 23485

Patent

active

061341185

ABSTRACT:
A method and apparatus for producing a multichip package comprising semiconductor chip and a substrate. The semiconductor chip includes conventional inner bond pads that are rerouted to other areas on the chip to facilitate connection with the substrate. The inner bonds are rerouted by covering the chip with a first insulation layer and opening the first insulation layer over the inner bond pads. A metal layer is then disposed over the first insulation layer in contact with the inner bond pads. A second insulation layer is disposed over the metal layer, and the second insulation layer is opened to expose selected portions of the metal layer to form external connection points. Electrically conductive epoxy is then disposed between the external connection points of the semiconductor chip and the terminals of the substrate, thereby electrically connecting the semiconductor chip to the substrate.

REFERENCES:
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4545840 (1985-10-01), Newman et al.
patent: 4578215 (1986-03-01), Bradley
patent: 4818823 (1989-04-01), Bradley
patent: 4999136 (1991-03-01), Su et al.
patent: 5074947 (1991-12-01), Estes et al.
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5237130 (1993-08-01), Kulesza et al.
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5611140 (1997-03-01), Kulesza et al.
patent: 5656863 (1997-08-01), Yasunaga et al.
patent: 5657206 (1997-08-01), Pedersen et al.
patent: 5724230 (1998-03-01), Poetzinger
patent: 5846853 (1998-12-01), Otsuki et al.

Affiliated with

Also associated with

Rating

Conductive epoxy flip-chip package and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive epoxy flip-chip package and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive epoxy flip-chip package and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-475514