Silicon segment programming method and apparatus

Details Silicon segment programming method and apparatus Silicon segment programming method and apparatus

1995-01-20

1997-12-16

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Contacts or leads including fusible link means or noise...

257723, 257724, H01L 2334

Patent

active

056988958

ABSTRACT:
The present invention is a method and apparatus for programming a stack of segments wherein each segment includes a plurality of die which are interconnected through metal interconnects patterned on the surface of each segment Once the segments are arranged into a stack, the stack is connected to external circuits and each segment is addressed through control lines. Electrically conductive fuses on the segments are used as an interface between the control lines and the die. Segment level programming is performed on each segment by opening the conductive fuses on the segments in a predetermined pattern in order to route the control lines to each segment such that segments are uniquely addressed. After segment level programming, circuit board programming is performed so that any defective die found in the stack is logically replaced with replacement die in the stack. This is accomplished by connecting a set of metal switches between all the die and each of the control lines and by dispensing a conductive epoxy whisker between the control line for the defective die and the metal switch of the replacement die. When a subsequent attempt is made to address the defective die in the stack, the replacement die is accessed instead.

REFERENCES:
patent: 3679941 (1972-07-01), Lacombe et al.
patent: 3691628 (1972-09-01), Kim et al.
patent: 3702025 (1972-11-01), Archer
patent: 3769702 (1973-11-01), Scarbrough
patent: 3813773 (1974-06-01), Parks
patent: 3999105 (1976-12-01), Archey
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4426773 (1984-01-01), Hargis
patent: 4525921 (1985-07-01), Carson et al.
patent: 4612083 (1986-09-01), Yasumoto et al.
patent: 4613891 (1986-09-01), Ng et al.
patent: 4646128 (1987-02-01), Carson et al.
patent: 4659931 (1987-04-01), Schmitz et al.
patent: 4672737 (1987-06-01), Carson et al.
patent: 4677528 (1987-06-01), Miniet
patent: 4703170 (1987-10-01), Schmitz
patent: 4706166 (1987-11-01), Go
patent: 4761681 (1988-08-01), Reid
patent: 4764846 (1988-08-01), Go
patent: 4783695 (1988-11-01), Eichelberger
patent: 4801992 (1989-01-01), Golubic
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4807021 (1989-02-01), Okumura
patent: 4827327 (1989-05-01), Miyauchi et al.
patent: 4835593 (1989-05-01), Arnold et al.
patent: 4862249 (1989-08-01), Carlson
patent: 4894706 (1990-01-01), Sato et al.
patent: 4897708 (1990-01-01), Clements
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 4907128 (1990-03-01), Solomon et al.
patent: 4939568 (1990-07-01), Kato
patent: 4941033 (1990-07-01), Kishida
patent: 4954875 (1990-09-01), Clements
patent: 4956694 (1990-09-01), Eide
patent: 4956695 (1990-09-01), Robinson et al.
patent: 4956746 (1990-09-01), Gates, Jr. et al.
patent: 4959749 (1990-09-01), Dzarnoski
patent: 4983533 (1991-01-01), Go
patent: 4989063 (1991-01-01), Kolesar, Jr.
patent: 4996583 (1991-02-01), Hatada
patent: 5006923 (1991-04-01), Warren
patent: 5013687 (1991-05-01), Solomon
patent: 5019943 (1991-05-01), Fassbender
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5028986 (1991-07-01), Sugano et al.
patent: 5032896 (1991-07-01), Little et al.
patent: 5055425 (1991-10-01), Leibovitz et al.
patent: 5093708 (1992-03-01), Solomon
patent: 5104820 (1992-04-01), Go et al.
patent: 5111278 (1992-05-01), Eichelberger
patent: 5117282 (1992-05-01), Salatino
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5135556 (1992-08-01), Hornback et al.
patent: 5138437 (1992-08-01), Kumamoto et al.
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5191404 (1993-03-01), Wu et al.
patent: 5191405 (1993-03-01), Tomita et al.
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5200300 (1993-04-01), Leibovitz
patent: 5202754 (1993-04-01), Bertin et al.
patent: 5221642 (1993-06-01), Burns
patent: 5222014 (1993-06-01), Lin
patent: 5229647 (1993-07-01), Gnadinger
patent: 5231304 (1993-07-01), Solomon
patent: 5247423 (1993-09-01), Lin et al.
patent: 5259110 (1993-11-01), Bross et al.
patent: 5270261 (1993-12-01), Bertin et al.
patent: 5270571 (1993-12-01), Parks et al.
patent: 5283107 (1994-02-01), Bayer et al.
patent: 5311401 (1994-05-01), Gates, Jr. et al.
patent: 5330359 (1994-07-01), Walker
patent: 5438166 (1995-08-01), Carey et al.
patent: 5444366 (1995-08-01), Chiu
Wojnarowski, R.J., et al., "Three Dimensional Hybrid Wafer Scan Integration Using the GE High Density Interconnect Process," IEEE International Conference on Wafer Scale Integration, Jan. 20, 1993.
Conte, Al S., "MCM-L The Answer for Desktop Workstations," ICEMM Proceedings, (1993) pp. 18-21.

Affiliated with

Also associated with

Rating

Silicon segment programming method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Silicon segment programming method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicon segment programming method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-209670