4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Michael Ford McAllister

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Electronic package structures using land grid array...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Method of constructing an integrated circuit memory

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Method of forming solid vias in a printed circuit board

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Probing systems for chilled environment

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Thin film wiring scheme utilizing inter-chip site surface...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Profile ID: LFUS-PAI-P-169996

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