Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-10-23
2007-10-23
Vu, Hien (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S067000
Reexamination Certificate
active
11386343
ABSTRACT:
Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.
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patent: 2007/0015375 (2007-01-01), Weiss
Becker Wiren Dale
Brodsky William Louis
Colgan Evan George
McAllister Michael Ford
Seminaro Edward
DeRosa Frank V.
F. Chau & Associates LLC
International Business Machines - Corporation
Vu Hien
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