Method of forming solid vias in a printed circuit board

Details Method of forming solid vias in a printed circuit board Method of forming solid vias in a printed circuit board

2011-08-02

2011-08-02

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S848000, C029S851000, C029S878000

Reexamination Certificate

active

07987587

ABSTRACT:
A method is described by which an electrical path is created between layers on a printed circuit board (PCB) without the use of plated through holes (PTH). Through the use of a liquid solder or conductive epoxy injection fixture, a conductive path is created in pre-drilled holes forming an electrical connection between internal PCB metal layers and surface mounted components without the creation of parasitic stubs on the signal nets.

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patent: 7240425 (2007-07-01), Khilchenko et al.
patent: 2001/0027842 (2001-10-01), Curcio et al.

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