4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Michael Brownell

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Apparatus for attaching a heat sink to the back side of a flip c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Controlled bondline thickness attachment mechanism

Metal working – Means to assemble or disassemble – Means to assemble electrical device
Patent

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Controlled bondline thickness attachment mechanism

Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate

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Heat pipe to baseplate attachment method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Heat pipe to baseplate attachment method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Profile ID: LFUS-PAI-P-188575

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