Heat pipe to baseplate attachment method

Details Heat pipe to baseplate attachment method Heat pipe to baseplate attachment method

1996-06-28

1997-12-16

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

29890032, 16510433, 361719, 257714, H05K 720

Patent

active

056992270

ABSTRACT:
An integrated circuit package which has a heat pipe that is incorporated into the body of the package. The package contains an integrated circuit which is mounted to a package substrate. The integrated circuit die is enclosed by a cover plate that is attached to the substrate. The heat pipe is attached to a nut that is screwed into the cover plate. The heat pipe has a bottom surface that is thermally coupled to the die to provide a direct thermal path between the integrated circuit and the heat pipe.

REFERENCES:
patent: 5095404 (1992-03-01), Chao
patent: 5162974 (1992-11-01), Currie
patent: 5412535 (1995-05-01), Chao
"Cooling Device--Modules", Clark, IBM Tech Discl Bull vol. 20 No. 5 Oct. 1977, pp. 1769-1771.

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