Controlled bondline thickness attachment mechanism

Details Controlled bondline thickness attachment mechanism Controlled bondline thickness attachment mechanism

1996-03-28

1998-09-08

Vo, Peter

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29741, 29760, 29841, 257713, 257719, 269903, 361705, 361709, 361720, H05K 118, H05K 702, H05K 720, H05K 1304

Patent

active

058027076

ABSTRACT:
A tool which accurately controls the thickness of a thermal grease applied to an integrated circuit that is mounted to a printed circuit board. The tool includes a bracket that supports the printed circuit board and the integrated circuit. A thermal grease is applied to the top surface of the integrated circuit. A lid is attached to the bracket to capture the printed circuit board. The lid has a platen that is separated from the integrated circuit by a space which has a predetermined thickness. The space defines the thickness of the thermal grease. Any excess thermal grease is pushed out of the space by the lid so that a consistent thickness of thermal grease is applied for each integrated circuit assembly. The bracket, lid, integrated circuit and printed circuit board can be mounted to a motherboard as a single integrated circuit module. Alternatively, the lid can be detached from the base so that the grease covered integrated circuit can be removed from the tool for subsequently assembly.

REFERENCES:
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patent: 5142444 (1992-08-01), Matta et al.
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patent: 5287617 (1994-02-01), Murphy
patent: 5297333 (1994-03-01), Kusaka
patent: 5332463 (1994-07-01), Eberlein et al.
patent: 5424580 (1995-06-01), Tustaniwskyi et al.
patent: 5430611 (1995-07-01), Pastel et al.
patent: 5504988 (1996-04-01), Avery et al.

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