Ball grid array integrated circuit package that has vias located

Details Ball grid array integrated circuit package that has vias located Ball grid array integrated circuit package that has vias located

1996-02-20

1998-01-06

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 174261, 174262, 174264, 361772, 361774, H05K 702, H05K 111

Patent

active

057061785

ABSTRACT:
A ball grid array (BGA) integrated circuit package which has a plurality of elliptically shaped solder pads located on a bottom surface of a package substrate. The bottom surface also has a solder mask which contains a number of holes that expose the solder pads. The holes allow solder balls to be attached to the solder pads. The solder balls can be reflowed to attach the package to a printed circuit board. The elliptical shaped solder pads have a width that is smaller than the length of the pads. The narrow pad portions provide additional routing space for the bottom surface of the package. The solder mask hole diameters are less than the lengths of the solder pads so that portions of the pads are anchored by the maskant material. The anchored portions increase the peel strength of the pads.

REFERENCES:
patent: 4954878 (1990-09-01), Fox et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5491364 (1996-02-01), Brandenburg et al.
patent: 5519936 (1996-05-01), Andros et al.
patent: 5557502 (1996-09-01), Banerjee et al.

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