Cavity mold cap BGA package with post mold thermally conductive

Details Cavity mold cap BGA package with post mold thermally conductive Cavity mold cap BGA package with post mold thermally conductive

1998-09-16

2000-11-14

Clark, Sheila V.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438126, 438127, 257707, 257706, H01L 31107

Patent

active

061469211

ABSTRACT:
An integrated circuit package which includes a thermal element that extends into a cavity of an injection molded housing. The cavity exposes at least a portion of an integrated circuit that is mounted to a substrate. The package includes an adhesive that attaches the thermal element to the housing and/or integrated circuit. The thermal element is assembled to the package after the housing has been molded onto the substrate and integrated circuit. Attaching the thermal element after the mold process can insure that the element is in direct thermal contact with the integrated circuit.

REFERENCES:
patent: 5216283 (1993-06-01), Lin
patent: 5444909 (1995-08-01), Mehr
patent: 5705851 (1998-01-01), Mostafazadeh et al.
patent: 5719442 (1998-02-01), Otsuki
patent: 5773886 (1998-06-01), Rostoker et al.

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