Corner heat sink which encloses an integrated circuit of a ball

Details Corner heat sink which encloses an integrated circuit of a ball Corner heat sink which encloses an integrated circuit of a ball

1997-11-26

1999-06-29

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257707, 257713, 361720, H05K 720

Patent

active

059177020

ABSTRACT:
An integrated circuit package. The package includes a substrate which has a first surface, a second opposite surface and a plurality of corners. A plurality of solder balls may be soldered to the second surface of the substrate. The solder balls can be reflowed to a printed circuit board. An integrated circuit is mounted to the first surface of the substrate. Each corner has a conductive plane located on the first surface of the substrate. The package includes a metal lid that is thermally coupled to the integrated circuit and attached to the conductive plane at the corner of the substrate. The lid encloses the integrated circuit and provides a thermal path from the integrated circuit to the conductive planes at the corners of the substrate. The thermal path allows heat generated by the integrated circuit to flow through the lid and into the printed circuit board.

REFERENCES:
patent: 4855867 (1989-08-01), Gazdik et al.
patent: 5510956 (1996-04-01), Suzuki
IBM Tech Disl. Bulletin, "Thermally Conductive Substrate Mounted Multi-Chip Module Cap", vol. 36, No. 09B, Sep. 1993, pp. 623-624. 361/704.

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