4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Michael A. Lamson

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Balanced capacitance lead frame for integrated circuits and inte

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Ball grid array package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Constant impedance routing for high performance integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate

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Differential pair geometry for integrated circuit chip packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Differential pair geometry for integrated circuit chip packages

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-149837

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