4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Thinning of semiconductor substrate

Matthew Reames

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Bond pad structure with stress-buffering layer capping...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Capacitive transducer circuit and method

Electrical audio signal processing systems and devices – Switching
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Combined semiconductor device, LED print head, and image...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
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Composite board with semiconductor chips and plastic housing...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Thermally responsive
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Defect-free junction formation using laser melt annealing of...

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
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Profile ID: LFUS-PAI-P-2159481

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